SightLine video processors provide powerful edge processing for any real-time applications. Each of our processors are designed to meet a variety of requirements. Compare our processors to find the one that meets your specifications.
Compare Processors
Processor
Texas Instruments DM3730
Texas Instruments DM8148 and Texas Instruments C6657
Qualcomm Snapdragon 820
Multi-Camera
Switching between inputs
Dual Processing with multi-camera display options: picture in picture, 2-up, blending, and switching
Dual Processing optional with multi-camera display options: picture in picture, blending, and switching
Digital Inputs
1
2
3
Camera Compatibility
(full list here)
HDMI, Sony FCB-EH6xxx, EH31xx, EV7xxx, Hitachi DI-SC120R, Tamron 10x, Airborne 720p GS, Camera Link, FLIR Tau, FLIR Quark, FLIR Boson, DRS Tamarisk
HDSDI, HDMI, Sony FCB-EH6xxx, EH31xx, EV7xxx, Hitachi DI-SC120R, Tamron 10x, Airborne 720p GS, Camera Link, FLIR Tau, FLIR Quark, FLIR Boson, DRS Tamarisk
3000-OEM cameras + MIPI and USB-3
Analog Inputs (NTSC/PAL)
2
3 (using dual analog to digital input adapter boards)
2 (using two 3000-AB adaptors, one on OEM and one on MIPI adapter)
Frame Size and Rate Out
SD @ 30fps
720p @ 15-30 fps dependent on SW configuration
720p @60 fps single channel
1080p @30 fps + SD @ 30 fps
2 x 720p @ 30 fps
2x 1080p @30 fps with full SW
4K @30 fps with encoding only
4K @ 15-30 fps other SW functions
Serial Ports Available
3 (@3.3V)
5 (@3.3V)
4 (@3.3V) ) + 4 with MIPI-Input adapter
Additional IO
I2C (1), GPIO (3+)
I2C (3), GPIO (4+)
I2C, GPIO (3) + 3 with MIPI-Input adapter
Ethernet Interface
10/100 BASE-T Ethernet PHY. UDP, TCP, and RTSP connectivity, unicast, multicast.
1500-OEM and 3000-OEM with capacitive coupling
Same Ethernet interfaces as 1500 and 3000, but with magnetic coupling
Encoded Video Output
H.264/MPEG4/M-JPEG encoding,
MPEG2 TS/RTP encapsulation
H.264 encoding,
MPEG2 TS/RTP encapsulation
H.264 and H.265 encoding, MPEG2 TS/RTP encapsulation
KLV / Metadata
System metadata can be inserted into KLV IP stream, used in OSD, with JPEG EXIF headers, full pixel snapshots, and KML or NITF files. KLV metadata is generated in accordance with MISB standards.
HDMI Output
HDSDI Output
Analog Output
No
No
Yes
Yes
Yes (with with HDSDI-output board)
Yes
No
Yes (with HDMI-HDSDI-output board)
Yes
Recording
Micro SD. Class 10 SDHC cards up to 400 GB
Interface for external Micro SD card
Class 10 SDHC cards up to 400 GB
Micro SD. Class 10 SDHC cards up to 400 GB
Voltage In / Power Consumption
4.5 – 6.5 VDC OEM (5 VDC nom)
Some adapter boards = 6.0 V max
3 W (max) 2.5W (typical)
8 – 15 VDC (12 VDC nom)
10 W (typical)
8 – 15 VDC (12 VDC nom)
5 W (startup current 3A per Smart Wireless Computing)
Size
1.04 x 1.48 inches (26.5 x 37.7 mm)
0.27 ounces (7.6 grams)
3.47 x 1.97 inches (88 x 50 mm)
1.4 ounces (39 grams)
2.0 x 1.5 inches (50.5 x 38mm)
0.45 ounces (13 grams)
Environment – Temperature
Temp: Demonstrated with basic delivered heatsink: -40°C to + 55°C
Temp Components: -40°C to + 85°C
Screened: -20°C to + 55°C ambient with delivered passive heatsink
-40°C start-up with heater circuit
Environment – EMI
MIL-STD-461 and CE confirmed as part of customer assembly
SightLine support of Customer Tests is TBD
Environment – Shock Vibe
MIL-STD-810 qualification confirmed as part of customer assembly
SightLine support of Customer Tests is TBD
Fabrication Quality Assurance
Boards are assembled to IPC-A-610 Class2 specifications by a facility certified to ISO 9001 and AS 9100 standards and using ROHS Directive 2011/65/EU compliant materials and processes.
