Compare Processors
SightLine video processors provide powerful edge processing for any real-time applications. Each of our processors is designed to meet a variety of requirements. Compare our processors to find the one that meets your specifications. Below lists specific criteria for you to review and compare processors to meet your requirements.
- OEM-Video Processor Options presents an overview of OEM options and comparative technical specifications.
- Integration Options presents a range of OEM, SOM, and Software options for customers to incorporate SightLine functionality.
4000-OEM
3000-OEM
1500-OEM
Summary
- Multiple video inputs – single channel processing
- Multiple video outputs – single-stream H.264/H.265 IP video, HDMI, HDSDI
- Processing and streaming up to 1080p30
- Smaller and lower power than 4000-OEM for use in the smallest systems
- OEM and SOM integration options
- Multiple video inputs – single or dual channel processing
- Multiple video outputs – dual-stream H.264/H.265 IP video, HDMI, HDSDI
- Most powerful option – processing and streaming to 4Kp30
- Smaller and lower power than 3000-OEM
- OEM and SOM integration options
- Multiple video inputs – dual channel processing
- Multiple video outputs – dual-stream H.264 IP video, analog, HDMI, HDSDI
- Processing and streaming to 1080p30
- Small size (business card footprint)
- SOM style, board-to-board Interface
- Single channel processing (multiple inputs and switching)
- Multiple video outputs – single-stream H.264 IP video, analog
- Processing and streaming to 720p25
- Tiny size for use in the smallest camera systems
- OEM and SOM integration options
Processor
NXP i.MX 8M Plus SOM
Qualcomm Snapdragon 820
Texas Instruments DM8148 and Texas Instruments C6657
Texas Instruments DM3730
Multi-Camera
Single channel processing. Switching between multiple camera inputs
Dual Processing optional with multi-camera display options: picture in picture, blending, and switching
Dual Processing with multi-camera display options: picture in picture, 2-up, blending, and switching
Switching between inputs
Digital Inputs
3
3
2
1
Analog Inputs (NTSC/PAL)
Switch between two inputs (MCX connectors) using MIPI-AB adapter board or 1 via 3000-AB board
2 (using two 3000-AB adaptors, one on OEM and one on MIPI adapter)
3 (using dual analog to digital input adapter boards)
2
Frame Size and Rate Out
720p @60 fps limited functions
1080p @30 fps with full SW
2x 1080p @30 fps with full SW
4K @30 fps with encoding only
4K @ 15-30 fps other SW functions
720p @60 fps single channel
1080p @30 fps + SD @ 30 fps
2 x 720p @ 30 fps
SD @ 30fps
720p @ 15-30 fps dependent on SW configuration
Serial Ports Available
2 (@3.3V) + 4 with MIPI-Input adapter
4 (@3.3V) ) + 4 with MIPI-Input adapter
5 (@3.3V)
3 (@3.3V)
Additional IO
GPIO (1) + GPIO (3) with MIPI-IN adapter
I2C, GPIO (3) + 3 with MIPI-Input adapter
I2C (3), GPIO (4+)
I2C (1), GPIO (3+)
Ethernet Interface
10/100 BASE-T Ethernet PHY. UDP, TCP, and RTSP connectivity, unicast, multicast.
With transformers (magnetics)
10/100 BASE-T Ethernet PHY. UDP, TCP, and RTSP connectivity, unicast, multicast.
1500-OEM and 3000-OEM with capacitive coupling
Encoded Video Output
H.264 and H.265 encoding, MPEG2 TS/RTP encapsulation
H.264 encoding,
MPEG2 TS/RTP encapsulation
H.264/MPEG4/M-JPEG encoding,
MPEG2 TS/RTP encapsulation
KLV / Metadata
System metadata can be inserted into KLV IP stream, used in OSD, with JPEG EXIF headers, full pixel snapshots, and KML or NITF files. KLV metadata is generated in accordance with MISB standards.
HDMI Output
HDSDI Output
Analog Output
Yes
Yes (with HDMI-HDSDI-output board)
No
Yes
Yes (with with HDSDI-output board)
Yes
No
No
Yes
Recording
Micro SD. Class 10 SDHC cards up to 400 GB
Interface for external Micro SD card
Class 10 SDHC cards up to 400 GB
Micro SD. Class 10 SDHC cards up to 400 GB
Voltage In / Power Consumption
8 – 15 VDC (12 VDC nom)
3 W typical
8 – 15 VDC (12 VDC nom)
5 W (startup current 3A per Smart Wireless Computing)
8 – 15 VDC (12 VDC nom)
10 W (typical)
4.5 – 6.5 VDC OEM (5 VDC nom)
Some adapter boards = 6.0 V max
3 W (max) 2.5W (typical)
Size
1.31 x 1.77 inches (33.3 x 45mm)
23 grams with HDSDI input board (SOM is 7.1)
2.0 x 1.5 inches (50.5 x 38mm)
0.45 ounces (13 grams)
3.47 x 1.97 inches (88 x 50 mm)
1.4 ounces (39 grams)
1.04 x 1.48 inches (26.5 x 37.7 mm)
0.27 ounces (7.6 grams)
Environment – Temperature
-40°C to + 85°C (component specifications)
Screened: -20°C to + 55°C ambient with delivered passive heatsink
-40°C start-up with heater circuit
Temp: Demonstrated with basic delivered heatsink: -40°C to + 55°C
Temp Components: -40°C to + 85°C
Environment – EMI
SightLine support of Customer Tests is TBD
MIL-STD-461 and CE confirmed as part of customer assembly
Environment – Shock Vibe
SightLine support of Customer Tests is TBD
MIL-STD-810 qualification confirmed as part of customer assembly
Fabrication Quality Assurance
Boards are assembled to IPC-A-610 Class2 specifications by a facility certified to ISO 9001 and AS 9100 standards and using ROHS Directive 2011/65/EU, 2015/863/EU compliant materials and processes.